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The HAKKO Hexsol Lead-Containing Solder Wire is a soldering consumable designed for electronic assembly, circuit board repair, electrical connections, and general soldering applications. Featuring a composition of 50% tin and 50% lead, this solder provides a specified alloy ratio for compatible soldering processes. It is available in wire diameters ranging from 1.2 mm to 1.6 mm, offering size options for different solder joint requirements and working applications. The HAKKO Hexsol Solder Wire is suitable for electronics workshops, manufacturing facilities, technical service centres, and maintenance environments where lead-containing solder materials are specified. Its clearly identified tin-lead composition and wire diameter range help users select solder material according to their application and equipment requirements.
The HAKKO 50% Tin, 50% Lead Solder is categorized as a soldering material for electronic component installation, printed circuit board assembly, repair, and electrical maintenance work. Its available wire diameters of 1.2 mm to 1.6 mm provide options for applications requiring different amounts of solder material. Before purchasing, users should verify the exact product designation, alloy composition, flux content, wire diameter, and melting characteristics against the official HAKKO specifications. The product title does not specify whether flux is included, so this detail should be confirmed before selection. Since the solder contains lead, appropriate handling, workplace hygiene, ventilation, and disposal procedures should follow applicable safety requirements. This HAKKO Hexsol solder is intended for compatible soldering operations requiring a 50/50 tin-lead alloy.

2 mm lead