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SCHOFIC 500 ml Thermal Grease Solder Paste for Heat Sink Compound for CPU and Chipse, ‎IPA01

SCHOFIC 500 ml Thermal Grease Solder Paste for Heat Sink Compound for CPU and Chipse, ‎IPA01

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Flat ₹400 off on Order above ₹10,000 | Valid for REPEAT Business User

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Flat ₹800 off on Order above ₹20,000 | Valid for REPEAT Business User

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Flat ₹200 off on Order above ₹6000 | Valid for REPEAT Business User

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Flat ₹400 off on Order above ₹10,000 | Valid for NEW Business Users

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Features
Type of Product IPA (E-Grade) to Clean
Model No ‎IPA01
Features Alcohol Based
Pack of 1
Warranty as Per Brand
Warranty as Per Brand
return policy
7 Days Return Policy
100% Original Products
100% Original Products
Secure Payments
Secure Payments
100% Buyer Protection
100% Buyer Protection
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Top Brands

Type of Product

IPA (E-Grade) to Clean

Model No

‎IPA01

Features

Alcohol Based

Pack of

1

Country of Origin

India

Item Form

Liquid

Name of Manufacturer/Packer/Importer

Schofic Technologies Private Limited

Product Dimensions

‎15x10x5 cm

Item Volume

500 ml

Specific use for the product

Industrial Machinery

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₹199 (Incl. of all taxes)
₹169 + 18% GST
MRP ₹999
80.08% OFF
Minimum Order Quantity- 1
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PREPAID
Available
PART COD
Unavailable
COD
Available
RETURN
Available Return period : 7 days