AS ONE Film Frame Shipper for 8-Inch Wafer, 1-8206-01

The AS ONE Film Frame Shipper for 8-Inch Wafer, identified by the model number 1-8206-01, is a specialized and reliable packaging solution designed to safely transport and protect delicate 8-inch wafers used in semiconductor and electronics manufacturing. This film frame shipper plays a critical role in safeguarding wafers during transit to ensure they remain intact and undamaged.

Key features and functionalities of the AS ONE Film Frame Shipper for 8-Inch Wafer 1-8206-01 include:

1. Wafer Protection: The shipper is specifically designed to securely hold and protect 8-inch wafers, preventing physical contact and potential damage during shipping

2. Durable Construction: It is typically constructed from robust and lightweight materials, providing structural integrity and resistance to impact and vibrations

3. Film Frame: The shipper includes a film frame that surrounds and encapsulates the wafer, offering an additional layer of protection against dust, particles, and electrostatic discharge (ESD)

4. Secure Closure: The packaging features a secure and easy-to-use closure mechanism, ensuring that the wafer remains firmly in place during transit

5. ESD Protection: ESD-sensitive wafers are shielded from electrostatic discharge, preventing potential damage to the delicate semiconductor components

6. Stackable Design: The film frame shippers are typically stackable, allowing for efficient storage and shipping, especially when multiple wafers need to be transported simultaneously

7. Customized Inserts: Some models may offer customizable inserts to accommodate different wafer thicknesses and protect various types of wafers

8. Labeling Space: The exterior of the shipper may include labeling space for easy identification and tracking of the wafer.

The AS ONE Film Frame Shipper for 8-Inch Wafer 1-8206-01 is an essential tool for the semiconductor industry, where precision and protection are paramount. It ensures the safe transit of wafers from manufacturing facilities to assembly and testing sites, reducing the risk of damage and defects that can impact semiconductor production. This packaging solution contributes to the reliability and quality of semiconductor products that power modern electronics.

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