Hillgrove HGACC11M1 22 SWG Tin Lead Alloy Quick Melt Soldering Wire Roll

With fast reflow, tin-lead alloy solder is ideal for making connections in electronics and electrical processing. This solder has a melting temperature of 254°C, a tensile strength of 25, 40 and 50 N/mm² and a thermal conductivity of 26 W/mK. It has a much lower fusible solidus than lead free types and resists oxidation at elevated temperatures.