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Hillgrove HGACC11M1 22 SWG Tin Lead Alloy Quick Melt Soldering Wire Roll Pack of 2 Rolls
by Hillgrove
Features |
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| Brand Name : | Hillgrove |
| Type : | - |
| Weight : | 30 g |
| Size (SWG) : | 22 SWG |
| Diameter : | 0.71-0.80 MM |
| Grade (Tin/Lead) : | 60/40 |
| More Details | |
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With fast reflow, tin-lead alloy solder is ideal for making connections in electronics and electrical processing. This solder has a melting temperature of 254°C, a tensile strength of 25, 40 and 50 N/mm² and a thermal conductivity of 26 W/mK. It has a much lower fusible solidus than lead free types and resists oxidation at elevated temperatures.
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545
(GST inclusive price)
462
(GST extra)
7.63% OFF
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