RS PRO Heatsink 17.9°C/W, 20x35x20 mm, 263251

The RS PRO Heatsink with a thermal resistance of 17.9°C/W and dimensions of 20x35x20 mm, identified as part number 263251, is a compact and highly effective cooling solution designed for a wide range of electronic applications. This heatsink is engineered to efficiently dissipate heat generated by electronic components, ensuring optimal performance and reliability. At its core, the RS PRO Heatsink is built with precision engineering and quality materials to provide effective thermal management. With its low thermal resistance of 17.9°C/W, it is capable of efficiently transferring heat away from sensitive electronic components such as microprocessors, voltage regulators, and power transistors. This helps in preventing overheating and thermal-related damage, ultimately extending the lifespan of electronic devices. The compact dimensions of 20x35x20 mm make this heatsink particularly suitable for space-constrained applications. Its small form factor allows it to be easily integrated into electronic assemblies, even in tight spaces where larger heatsinks may not fit. This versatility makes it a valuable tool for miniaturized electronics, including embedded systems and compact PCB layouts. The RS PRO Heatsink is designed with user-friendly features to simplify installation and maximize effectiveness. It comes with pre-drilled mounting holes for easy attachment to PCBs or enclosures, and its lightweight construction minimizes added weight to the electronic assembly. Additionally, the heatsink is made from materials that offer excellent thermal conductivity, ensuring efficient heat transfer. In electronic applications where temperature control is critical, safety is a paramount concern. The RS PRO Heatsink is designed and manufactured to meet industry standards and regulations, providing a reliable and safe solution for managing heat in electronic devices. In summary, the RS PRO Heatsink with a thermal resistance of 17.9°C/W and dimensions of 20x35x20 mm, part number 263251, is a compact and highly efficient cooling component designed to meet the thermal management needs of various electronic applications. Its precision engineering, compact form factor, ease of installation, and adherence to safety standards make it an indispensable tool for preventing overheating and ensuring the reliable performance of electronic components and devices, even in space-constrained environments.

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